Rainbow Electronics ISD5216 - Manual (Page 81)

I5216 SERIES
Advanced Information
PRELIMINARY
Publication Release Date: November 30, 2001
- 81 Revision A1
I5216 SERIES BONDING PHYSICAL LAYOUT
(1)
(UNPACKAGED DIE)
1. The backside of die is internally connected to Vss. It MUST NOT be connected to any other
potential or damage may occur.
2. Double bond recommended.
This figure reflects the current die thickness. Please contact Winbond as this thickness may change
in the future.
I5216 Series
Die Dimensions
X: 4380 µ m
Y: 9880 µ m
Die Thickness (3)
292.1 µ m + 12.7 µ m
Pad Opening
90 x 90 µ m
3.5 x 3.5 mils
V
SSD
V
SSD
A0 SDA A1 SCL V
CCD
V
CCD
MCLK INT RAC SDIO SDI V
SSA
V
SSA
MIC+ MIC - MICBS ACAP SP- V
SSA
(2) SP+ V
CCA
(2) AUXIN AUXOUT SCK WS
I5216
I5216 Series
Die Dimensions
X: 4380 µ m
Y: 988 µ m
Die Thickness (3)
292.1 µ m + 12.7 µ m
Pad Opening
90 x 90 µ m
3.5 x 3.5 mils
V
SSD
V
SSD
A0 SDA A1 SCL V
CCD
V
CCD
MCLK INT RAC SDIO SDI V
SSA
V
SSA
MIC+ MIC - MICBS ACAP SP- V
SSA
(2) SP+ V
CCA
(2) AUXIN AUXOUT SCK WS
I5216
I5216 Series
Die Dimensions
X: 4380 µ m
Y: 9880 µ m
Die Thickness (3)
292.1 µ m + 12.7 µ m
Pad Opening (min)
90x 90 µ m
3.5 x 3.5 mils