Rainbow Electronics ISD5216 - Manual (Page 51)

I5216 SERIES
Advanced Information
PRELIMINARY
Publication Release Date: November 30, 2001
- 51 - Revision A1
POWER AND GROUND PINS
V
CCA
, V
CCD
(Voltage Inputs)
To minimize noise, the analog and digital circuits in the Winbond I5216 device use separate power
busses. These +3 V busses lead to separate pins. Tie the V
CCD
pins together as close as possible, and
decouple both supplies as near to the package as possible.
V
SSA
, V
SSD
(Ground Inputs)
The Winbond I5216 series utilizes separate analog and digital ground busses. The analog ground
(V
SSA
) pins should be tied together as close to the package as possible, and connected through a low-
impedance path to power supply ground. The digital ground (V
SSD
) pin should be connected through a
separate low impedance path to power supply ground. These ground paths should be large enough to
ensure that the impedance between the V
SSA
pins and the V
SSD
pin is less than 3Ω. The backside of
the die is connected to V
SSD
through the substrate resistance. In a chip-on-board design, the die attach
area must be connected to V
SSD
.
NC (No Connect)
These pins should not be connected to the board at any time. Connection of these pins to any signal,
ground or V
CC,
may result in incorrect device behavior or cause damage to the device.