Cirrus Logic CS35L32 - Manual (Page 50)

50 DS963F4
CS35L32
10 Package Dimensions
10 Package Dimensions
Figure 10-1. 30-Ball WLCSP Package Drawing
11 Thermal Characteristics
12 Ordering Information
Table 11-1. Thermal Resistance
Parameters Symbol Min Typical Max Units
Junction-to-ambient thermal impedance 
JA
— 50 — °C/Watt
Table 12-1. Ordering Information
Product Description Package Halogen Free Pb Free Grade Temperature Range Container Order Number
CS35L32 Boosted Class D Amplifier
with Speaker-Protection
Monitoring and Flash LED
Drivers
30-ball
WLCSP
Yes Yes Commercial –10°C to 70°C Tape and
Reel
CS35L32-CWZR
e
WAFER BACK SIDE SIDE VIEW
Ball A1 Location
Indicator
X
Y
A
A2
A1
BUMP SIDE
e
N
M
c
d
Ball A1
Location
Indicator
b
Seating plane
X
Z
Y
Notes:
• Dimensioning and tolerances per ASME Y 14.5M–1994.
• The Ball A1 position indicator is for illustration purposes only and may not be to scale.7
• Dimension “b” applies to the solder sphere diameter and is measured at the midpoint between the package body and the seating plane
Datum Z.
Table 10-1. WLCSP Package Dimensions
Dimension
Millimeters
Minimum Nominal Maximum
A 0.451 0.494 0.537
A1 0.169 0.194 0.219
A2 0.275 0.3 0.325
M BSC 2.000 BSC
N BSC 1.600 BSC
b 0.243 0.268 0.293
c REF 0.264 REF
d REF 0.295 REF
e BSC 0.400 BSC
X 2.560 2.590 2.620
Y 2.108 2.138 2.168
ccc = 0.10
ddd = 0.05
Note:
Controlling dimension is millimeters.
øb
Øddd Z X Y
Øccc Z