Rainbow Electronics W25Q32 - Manual (Page 53)

W25Q80, W25Q16, W25Q32
Publication Release Date: June 20, 2007
- 53 - Advanced - Revision A5
12. PACKAGE SPECIFICATION
12.1 8-Pin SOIC 208-mil (Package Code SS)
MILLIMETERS INCHES
SYMBOL
MIN MAX MIN MAX
A 1.75 2.16 0.069 0.085
A1 0.05 0.25 0.002 0.010
A2 1.70 1.91 0.067 0.075
b 0.35 0.48 0.014 0.019
C 0.19 0.25 0.007 0.010
D 5.18 5.38 0.204 0.212
E 7.70 8.10 0.303 0.319
E1 5.18 5.38 0.204 0.212
e 1.27 BSC 0.050 BSC
L 0.50 0.80 0.020 0.031
θ 0 o 8 o 0 o 8 o
y --- 0.10 --- 0.004
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.