2 documentation support – Texas Instruments Digital Signal Processor SM320F2812-HT User Manual
Page 81
PREFIX
SM
320
F
2812
HFG
TMX = experimental device
TMP = prototype device
TMS = qualified device
SM
= commercial processing
SMJ = MIL-PRF-38535 (QML)
DEVICE FAMILY
320 = TMS320 DSP Family
TECHNOLOGY
PACKAGE TYPE
†
HFG = 172-pin CQFP
KGD = Die
DEVICE
2810
TEMPERATURE RANGE
M
S = -55°C to 220°C
F = Flash EEPROM (1.8-V/1.9-V Core/3.3-V I/O)
C = ROM (1.8-V/1.9-V Core/3.3-V I/O)
2811
2812
†
Not all combinations of processing options, temperature ranges and packages are available.
CQFP = Ceramic Quad Flatpack
SGUS062B
–
JUNE 2009
–
REVISED JUNE 2011
Figure 5-1. 28x Device Nomenclature
5.2
Documentation Support
Extensive documentation supports all of the TMS320E DSP family generations of devices from product
announcement through applications development. The types of documentation available include: data
sheets and data manuals, with design specifications; and hardware and software applications. Useful
reference documentation includes:
TMS320C28x DSP CPU and Instruction Set Reference Guide
) describes the central
processing unit (CPU) and the assembly language instructions of the TMS320C28x
™
fixed-point digital
signal processors (DSPs). It also describes emulation features available on these DSPs.
TMS320x281x Analog-to-Digital Converter (ADC) Reference Guide (
describes the ADC
module. The module is a 12-bit pipelined ADC. The analog circuits of this converter, referred to as the
core in this document, include the front-end analog multiplexers (MUXs), sample-and-hold (S/H) circuits,
the conversion core, voltage regulators, and other analog supporting circuits. Digital circuits, referred to as
the wrapper in this document, include programmable conversion sequencer, result registers, interface to
analog circuits, interface to device peripheral bus, and interface to other on-chip modules.
TMS320x281x Boot ROM Reference Guide (
describes the purpose and features of the
bootloader (factory-programmed boot-loading software). It also describes other contents of the device
on-chip boot ROM and identifies where all of the information is located within that memory.
TMS320x281x Event Manager (EV) Reference Guide (
describes the EV modules that
provide a broad range of functions and features that are particularly useful in motion control and motor
control applications. The EV modules include general-purpose (GP) timers, full-compare/PWM units,
capture units, and quadrature-encoder pulse (QEP) circuits.
TMS320x281x External Interface (XINTF) Reference Guide (
describes the external interface
(XINTF) of the 281x digital signal processors (DSPs).
TMS320x281x Multi-channel Buffered Serial Ports (McBSPs) Reference Guide
describes
the McBSP) available on the 281x devices. The McBSPs allow direct interface between a DSP and other
devices in a system.
TMS320x281x System Control and Interrupts Reference Guide
describes the various
interrupts and system control features of the 281x digital signal processors (DSPs).
Copyright
©
2009
–
2011, Texas Instruments Incorporated
Development Support
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