Texas Instruments Digital Signal Processor SM320F2812-HT Instruction Manuals and User Guides
We have 1 Instruction Manual and User Guide for Digital Signal Processor SM320F2812-HT Texas Instruments
Manuals 
| Recognized languages: | English |
|---|---|
| Pages: | 153 |
| Size: | 1.36 MB |
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Document Outline
- Table of Contents
- 1 Features
- 2 Introduction
- 3 Functional Overview
- 3.1 Memory Map
- 3.2 Brief Descriptions
- 3.2.1 C28x CPU
- 3.2.2 Memory Bus (Harvard Bus Architecture)
- 3.2.3 Peripheral Bus
- 3.2.4 Real-Time JTAG and Analysis
- 3.2.5 External Interface (XINTF)
- 3.2.6 Flash
- 3.2.7 L0, L1, H0 SARAMs
- 3.2.8 Boot ROM
- 3.2.9 Security
- 3.2.10 Peripheral Interrupt Expansion (PIE) Block
- 3.2.11 External Interrupts (XINT1, XINT2, XINT13, XNMI)
- 3.2.12 Oscillator and PLL
- 3.2.13 Watchdog
- 3.2.14 Peripheral Clocking
- 3.2.15 Low-Power Modes
- 3.2.16 Peripheral Frames 0, 1, 2 (PFn)
- 3.2.17 General-Purpose Input/Output (GPIO) Multiplexer
- 3.2.18 32-Bit CPU Timers (0, 1, 2)
- 3.2.19 Control Peripherals
- 3.2.20 Serial Port Peripherals
- 3.3 Register Map
- 3.4 Device Emulation Registers
- 3.5 External Interface, XINTF
- 3.6 Interrupts
- 3.7 System Control
- 3.8 OSC and PLL Block
- 3.9 PLL-Based Clock Module
- 3.10 External Reference Oscillator Clock Option
- 3.11 Watchdog Block
- 3.12 Low-Power Modes Block
- 4 Peripherals
- 4.1 32-Bit CPU-Timers 0/1/2
- 4.2 Event Manager Modules (EVA, EVB)
- 4.3 Enhanced Analog-to-Digital Converter (ADC) Module
- 4.4 Enhanced Controller Area Network (eCAN) Module
- 4.5 Multichannel Buffered Serial Port (McBSP) Module
- 4.6 Serial Communications Interface (SCI) Module
- 4.7 Serial Peripheral Interface (SPI) Module
- 4.8 GPIO MUX
- 5 Development Support
- 6 Electrical Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 Recommended Operating Conditions
- 6.3 Electrical Characteristics
- 6.4 Current Consumption by Power-Supply Pins Over Recommended Operating Conditions During Low-Power Modes at 150-MHz SYSCLKOUT
- 6.5 Current Consumption Graphs
- 6.6 Reducing Current Consumption
- 6.7 Power Sequencing Requirements
- 6.8 Signal Transition Levels
- 6.9 Timing Parameter Symbology
- 6.10 General Notes on Timing Parameters
- 6.11 Test Load Circuit
- 6.12 Device Clock Table
- 6.13 Clock Requirements and Characteristics
- 6.14 Reset Timing
- 6.15 Low-Power Mode Wakeup Timing
- 6.16 Event Manager Interface
- 6.17 General-Purpose Input/Output (GPIO) – Output Timing
- 6.18 General-Purpose Input/Output (GPIO) – Input Timing
- 6.19 SPI Master Mode Timing
- 6.20 SPI Slave Mode Timing
- 6.21 External Interface (XINTF) Timing
- 6.22 XINTF Signal Alignment to XCLKOUT
- 6.23 External Interface Read Timing
- 6.24 External Interface Write Timing
- 6.25 External Interface Ready-on-Read Timing With One External Wait State
- 6.26 External Interface Ready-on-Write Timing With One External Wait State
- 6.27 XHOLD and XHOLDA
- 6.28 XHOLD/XHOLDA Timing
- 6.29 On-Chip Analog-to-Digital Converter
- 6.29.1 ADC Absolute Maximum Ratings
- 6.29.2 ADC Electrical Characteristics Over Recommended Operating Conditions
- 6.29.3 Current Consumption for Different ADC Configurations (at 25-MHz ADCCLK)
- 6.29.4 ADC Power-Up Control Bit Timing
- 6.29.5 Detailed Description
- 6.29.6 Sequential Sampling Mode (Single Channel) (SMODE = 0)
- 6.29.7 Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1)
- 6.29.8 Definitions of Specifications and Terminology
- 6.30 Multichannel Buffered Serial Port (McBSP) Timing
- 6.31 Flash Timing
- 7 Mechanical Data
- Revision History