Texas Instruments Digital Signal Processor SM320F2812-HT - Manual (Page 14)

SM320F2812-HT
SGUS062B – JUNE 2009 – REVISED JUNE 2011 www.ti.com
2.3 Die Layout
The SM320F2812 die layout is shown in Figure 2-1 . See Table 2-3 for a description of each pad's
function.
Figure 2-1. SM320F2812 Die Layout
Table 2-2. Bare Die Information
DIE PAD
DIE PAD DIE BACKSIDE BACKSIDE
DIE SIZE DIE PAD SIZE COMPOSITI
COORDINATES THICKNESS FINISH POTENTIAL
ON
219.4 x 207.0 (mils); Silicon with
55.0 x 64.0 ( μ m) See Table 2-3 11.0 mils AlCu/TiN Ground
5572.0 x 5258.0 ( μ m) backgrind
14 Introduction Copyright © 2009 – 2011, Texas Instruments Incorporated
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