Motorola SSETM 5000 - Manual (Page 61)

6881094C12-A November 11, 2004
Test Equipment and Service Aids: Service Aids 3-5
ChipMaster Nozzles:
6680333E28 PA nozzle Soldering and unsoldering ICs 3
6680332E83 PLCC-28* nozzle
6680332E93 PLCC-32 nozzle
6680332E82 PLCC-44* nozzle
6680332E94 PLCC-52 nozzle
6680332E95 PLCC-68* nozzle
6680332E96 PLCC-84 nozzle
6680332E89 QFP-80 nozzle
6680332E90 QFP-100* nozzle
6680332E91 QFP-132* nozzle
6680334E67 QFP-160 nozzle
6680332E86 SOIC-14/SOL-16J
nozzle
6680333E46 SOL-18 nozzle
6680332E84 SOIC-20 nozzle
6680332E87 SOL-20J nozzle
6680333E45 SOL-24 nozzle
6680332E88 SOL-28J nozzle
6680333E54 TSOP-32 nozzle
6680333E55 TSOP-64 nozzle
* Included with ChipMaster packages
To maintain the integrity of the RF PA, never heat it above 210 ° C while performing repair or
rework procedures. To prevent overheating the RF PA during rework, use a ChipMaster (R1319
or R1321) top-side pre-heat set point of 215
° C and a Dragon (R1427) bottom-side pre-heat set
point of 204 ° C for 1 minute before and throughout top-side heat application, assuming that the
RF PA is removed from the applied heat 10 seconds after reflow occurs. (The RF PA
temperature does not reach the ChipMaster’s internal set point temperature). All other parts on
the transceiver board can be reworked with ChipMaster top-side heat alone.
Table 3-2. Service Aids (Continued)
Motorola
Part
Number
Description Application
Service
Level
!
C a u t i o n