Ivoclar Vivadent IPS e.max Press Abutment Solutions v.2 - Manual (Page 38)

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Screw Ti base onto a model analog. Mark the relative position to the
pressed object.
Carefully blast the bonding area with Al
2
O
3
(50–100 µm) at low pressure until an even
mat surface has been achieved.
Apply wax to protect the emergence profile. In addition, seal also the screw channel
with wax.
Clean with an instrument and steam cleaner. Make sure that any
wax residue is carefully removed.
Pre-treatment of the Ti base
To prepare the Ti base for cementation with the pressed object, please observe the following procedure:
– Observe processing instructions of the manufacturer of the Ti base.
– Clean the Ti base in an ultrasonic cleaner and blow dry or use a steam cleaner.
– Screw Ti base onto a model analog.
– Place the pressed object on the Ti base and mark the relative position of the components. This facilitates locating the
correct position when the parts are assembled at a later stage.
– The emergence profile of the Ti base must not be blasted or modified in any way. To protect the emergence profile,
hard modelling wax is applied, as this material can be easily removed later on.
– Seal the screw channel with wax.
– Carefully blast the bonding area with Al
2
O
3
(50–100 µm) at low pressure until an even mat surface has been achieved.
– Clean with an instrument and steam cleaner. Make sure that any wax residue is carefully removed.
– After cleaning, any contamination of the bonding surface must be prevented, since contaminations negatively influence
the bond.
– Apply Monobond Plus on the cleaned bonding surface and allow to react for 60 seconds. After the reaction time, dry
the remaining residue with water- and oil-free air.
– Seal the screw channel with a foam pellet or wax. Make sure that the bonding surface is not contaminated.