INFICON SID-242 Thin Film Deposition Controller - Manual (Page 5)

Table of Contents
Chapter 1 Introduction
1.0 SID-242 Introduction ........................................................................................1-1
1.1 SRC Series Computer ......................................................................................1-1
1.2 SQM-242 Deposition Control Card ...................................................................1-2
1.3 SQS-242 CoDeposition Control Software ........................................................1-2
1.4 Digital I/O .........................................................................................................1-3
Chapter 2 Quick Start
2.0 Introduction ......................................................................................................2-1
2.1 Installation ........................................................................................................2-1
2.2 Front Panel ......................................................................................................2-2
2.3 Program Startup ...............................................................................................2-3
2.4 Single Layer Process Setup .............................................................................2-4
2.5 Single Layer Process Simulation ......................................................................2-8
2.6 SoftKey Functions ............................................................................................2-10
2.7 Multi-Layer CoDeposition Process ...................................................................2-11
2.8 Conclusion .......................................................................................................2-15
Chapter 3 SQS-242 Software
3.0 Introduction ......................................................................................................3-1
3.1 Installation and Registration .............................................................................3-2
3.2 Operation .........................................................................................................3-2
3.3 File Menu .........................................................................................................3-4
3.4 Edit Menu .........................................................................................................3-5
3.4.1 Processes....................................................................................................3-6
Layers .....................................................................................................3-7
Rate Ramps ............................................................................................3-9
Deposition ...............................................................................................3-10
Conditioning ............................................................................................3-12
Sources and Sensors ..............................................................................3-13
3.4.2 Films ............................................................................................................3-15
3.4.3 Materials ......................................................................................................3-16