Rainbow Electronics MAX3942 - Manual (Page 10)

MAX3942
10Gbps Modulator Driver
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Package Information
For the latest package outline information, go to
www.maxim-ic.com/packages .
Exposed-Pad Package
The exposed pad on the 24-pin QFN provides a very
low thermal resistance path for heat removal from the
IC. The pad is also electrical ground on the MAX3942
and must be soldered to the circuit board ground for
proper thermal and electrical performance. Refer to
Maxim Application Note HFAN-08.1: Thermal
Considerations for QFN and Other Exposed-Pad
Packages for additional information.
Figure 6. Simplified Output Circuit
MAX3942
50 Ω 50 Ω
OUT+
GND
V
EE
OUT-
GND
V
EE
GND GND
Chip Information
TRANSISTOR COUNT: 1918
PROCESS: SiGe Bipolar
24 23 22 21 20 19
7 8 9 10 11 12
13
14
15
16
17
18
6
5
4
3
2
1
MAX3942
24 THIN QFN (4mm x 4mm)
TOP VIEW
DATA+
DATA-
GND
GND
CLK+
CLK-
EXPOSED PAD CONNECTED TO GROUND
V
EE
RTEN MODEN V
EE
PLRT V
EE
V EE
GND
OUT+
OUT-
GND
V EE
V
EE
V
EE
MODSET
PWC- PWC+
V
EE.
Pin Configuration
PART PACKAGE TYPE PACKAGE CODE
MAX3942ETG
24 Thin QFN
(4mm ✕ 4mm ✕ 0.8mm)
T2444-1