Avago Technologies LSI53C180 - Manual (Page 54)

3-20 Specifications
3.3 Mechanical Drawings
LSI Logic component dimensions conform to a current revision of the
JEDEC Publication 95 standard package outline, using ANSI 14.5Y
“Dimensioning and Tolerancing” interpretations. As JEDEC drawings are
balloted and updated, changes may have occurred. To ensure the use
of a current drawing, the JEDEC drawing revision level should be
verified. Visit www.jedec.org representing the Solid State Technology
Association. Search for Publication 95 and click on MO Mechanical
Outlines for drawings and revision levels.
For printed circuit board land patterns that will accept LSI Logic
components, it is recommended that customers refer to the IPC
standards (Institute for Interconnecting and Packaging Electronic
Circuits). Specification number IPC-SM-782, “Surface Mount Design and
Land Pattern Standard” is an established method of designing land
patterns. Feature size and tolerances are industry standards based on
IPC assumptions.