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Table 2-7, Chan, Figure 2-9 – ADLINK CoreModule 745 User Manual

Page 23: Stack height of cooling assembly, Adlink optional cooling solutions

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Chapter 2

Product Overview

CoreModule 745

Reference Manual

17

Figure 2-9. Stack Height of Cooling Assembly

Table 2-7. ADLINK Optional Cooling Solutions

Cooling Solution

Description

Passive Heatsink - Copper
(without fan)

Qualified to maintain optimal performance between -40°C and +85°C.
CPU throttles to 1000MHz. (Note: The D525 CPU is qualified only for
-20°C to +70°C with a copper heatsink.)

Passive Heatsink - Aluminum
(without fan)

Qualified to maintain optimal performance between -20°C and +70°C.
Airflow requirement: 2 m/s. (Note: The D525 CPU is not qualified to
use an aluminum heatsink.)

Active Heatsink
(with fan)

Qualified to maintain optimal performance between -40°C and +85°C.
(Note: The D525 CPU requires an active heatsink for temperatures
between +70°C and +85°C.)

NOTE

All heights are given in inches.

0.39

0.44

0.60

Copper Passive Heatsink

Fan

CoreModule 745

CoreModule 745

CoreModule 745

0.11

1.50

0.98

Active Heatsink

0.39

0.44

0.60

Aluminum Passive Heatsink