ADLINK CoreModule 745 - Manual (Page 20)

Chapter 2 Product Overview
14 Reference Manual CoreModule 745
Specifications
Physical Specifications
Table 2-4 provides the physical dimensions of the CoreModule 745.
Table 2-4. Weight and Footprint Dimensions
Item Dimension
NOTE Overall height is measured from the
upper board surface to the highest
permanent component (PC/104 bus
connector) on the upper board surface.
This measurement does not include the
heatsink, which can vary. The heatsink
could increase this dimension.
Component height should not exceed
0.345" (8.763mm) from the upper
surface of the board and 0.190"
(4.826mm) from the lower surface of the
board. See
Figure 2-9 for the stack
heights of the heatsinks on the board.
Weight 0.12 kg (0.25 lbs)
Height (overall) 11.05 mm (0.435 inches)
Board thickness 2.362 mm (0.093 inches)
Width 96.01 mm (3.78 inches)
Length 115.57 mm (4.55 inches)