Ball pbga package characteristics, Ball pbga package specifications, Figure 13. 256-ball pbga package – Cirrus Logic EP7309 User Manual
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Copyright Cirrus Logic, Inc. 2011
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29
EP7309
High-Performance, Low-Power System on Chip
256-Ball PBGA Package Characteristics
256-Ball PBGA Package Specifications
Figure 13. 256-Ball PBGA Package
Note:
1) For pin locations see
.
2) Dimensions are in millimeters (inches), and controlling dimension is millimeter
3) Before beginning any new EP7309 design, contact Cirrus Logic for the latest package information.
TOP VIEW
17.00 (0.669)
15.00 (0.590)
SIDE VIEW
BOTTOM VIEW
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
1.00 (0.040)
Pin 1 Indicator
Pin 1 Corner
Pin 1 Corner
16 15 14 13 12 11 10 9 8
7
6 5
4
3
2
1
15.00 (0.590)
2 Layer
17.00 (0.669)
17.00 (0.669)
1.00 (0.040)
1.00 (0.040)
1.00 (0.040)
30° TYP
REF
REF
0.50
3 Places
0.85 (0.034)
±0.05 (.002)
0.40 (0.016)
±0.05 (.002)
0.36 (0.014)
17.00 (0.669)
R
D1
E1
D
E
±0.20 (.008)
±0.20 (.008)
±0.20 (.008)
±0.20 (.008)
±0.09 (0.004)
JEDEC #: MO-151
Ball Diameter: 0.50 mm ± 0.10 mm
17 ¥ 17 ¥ 1.61 mm body