Cirrus Logic EP7309 - Manual (Page 24)

24

Copyright Cirrus Logic, Inc. 2011
(All Rights Reserved) DS507F2
EP7309
High-Performance, Low-Power System on Chip
Packages
208-Pin LQFP Package Characteristics
208-Pin LQFP Package Specifications
Note: 1) Dimensions are in millimeters (inches), and controlling dimension is millimeter.
2) Drawing above does not reflect exact package pin count.
3) Before beginning any new design with this device, please contact Cirrus Logic for the latest package information.
4) For pin locations, please see
Figure 12 . For pin descriptions see the EP7309 User’s Manual.
Figure 11. 208-Pin LQFP Package Outline Drawing
Pin 1 Indicator
29.60 (1.165)
30.40 (1.197)
0.17 (0.007)
0.27 (0.011)
27.80 (1.094)
28.20 (1.110)
0.50
(0.0197)
BSC
29.60 (1.165)
30.40 (1.197)
27.80 (1.094)
28.20 (1.110)
1.35 (0.053)
1.45 (0.057)
0  MIN
7
 MAX
0.09 (0.004)
0.20 (0.008)
1.40 (0.055)
0.45 (0.018)
0.75 (0.030)
0.05 (0.002)
1.00 (0.039) BSC
Pin 1
Pin 208
1.60 (0.063)
0.15 (0.006)
EP7309
208-Pin LQFP