Package mechanical dimensions, Power estimate, 5 package mechanical dimensions – Rainbow Electronics DS3164 User Manual
Page 12: 6 power estimate
Maxim/Dallas Semiconductor Confidential
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5 PACKAGE
MECHANICAL
DIMENSIONS
The target package is a 27x27 mm 400-lead TE
-CSBGA with ball pitch of 1.27mm for all port density
configuration.
6 POWER
ESTIMATE
Current typical power estimate is 2 Watts at 3.3V (pending mode of operation).
1
TE-CSBGA = Thermally Enhanced Chip Scale Ball Grid Array
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