Electrical characteristics, Absolute maximum ratings, Ac/dc parameters – Rainbow Electronics AT83C24NDS User Manual
Page 28: Table 18, At83c24

28
4234F–SCR–10/05
AT83C24
Electrical Characteristics
Absolute Maximum Ratings
*
(**) Exposed die attached pad must be soldered to ground
Thermal resistor are measured on multilayer PCB with 0 m/s air flow.
(***) including shortages between any groups of smart card pins.
AC/DC Parameters
EVCC connected to host power supply: from 1.6V to 5.5V.
T
A
= -40
°C to +85°C; V
SS
= 0V; V
CC
= 3V to 5.5V.
CLASS A card supplied with CVCC = 4.75 to 5.25V for AT83C24NDS
CLASS A card supplied with CVCC = 4.6 to 5.25V for AT83C24
CLASS B card supplied with CVCC = 2.8V to 3.2V
CLASS C card supplied with CVCC = 1.68V to 1.92V
Ambient Temperature Under Bias: .....................-40
°C to 85°C
Storage Temperature: ................................... -65
°C to +150°C
Voltage on VCC: ........................................ V
SS
-0.5V to +6.0V
Voltage on SCIB pins (***): ......... CVSS
-0.5V to CVCC + 0.5V
Voltage on host interface pins:....... VSS
-0.5V to EVCC + 0.5V
Voltage on other pins: ...................... VSS
-0.5V to VCC + 0.5V
Power Dissipation: .......................................................... 1.5W
Thermal resistor of QFN pack-
age..(**)............................35°C/W
Thermal resistor of SO package.................................48°C/W
*NOTICE:
Stresses at or above those listed under “Absolute
Maximum Ratings” may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions above those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions may affect device reliability.
Power Dissipation value is based on the maxi-
mum allowable die temperature and the thermal
resistance of the package.
Table 17. Core (VCC)
Symbol
Parameter
Min
Typ
Max
Unit
Test Conditions
V
PFDP
Power fail high level threshold
2.4
2.5
2.6
V
V
PFDM
Power fail low level threshold
2.25
2.35
2.45
V
t
rise,
t
fall
V
DD
rise and fall time
1
μs
600s
Not tested.
Table 18. Host Interface (I/O, C4, C8, CLK, A2, A1, A0, CMDVCC, PRES/INT)
Symbol
Parameter
Min
Typ
Max
Unit
Test Conditions
V
IL
Input Low-voltage
-0.5
0.3 x EVCC
0.25 x EVCC
V
EVCC from 2.7V to VCC
EVCC from 1.6 to 2.7V
V
IH
Input High Voltage
0.7 x EVCC
EVCC + 0.5
V
EAUTO=0
EAUTO=1
EVCC from 1.6V to VCC