Table 15.2 128 pin qfp package parameters, Datasheet – SMSC LAN91C111 User Manual
Page 127
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Datasheet
SMSC LAN91C111 REV C
127
Revision 1.91 (08-18-08)
DATASHEET
Notes:
1.
Controlling Unit: millimeter
2.
Tolerance on the position of the leads is + 0.04 mm maximum.
3.
Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
4.
Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5.
Details of pin 1 identifier are optional but must be located within the zone indicated.
Figure 15.2 128 Pin QFP Package Outline, 3.9 MM Footprint
Table 15.2 128 Pin QFP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
~
~
3.4
Overall Package Height
A1
0.05
~
0.5
Standoff
A2
2.55
~
3.05
Body Thickness
D
23.70
23.90
24.10
X Span
D/2
11.85
11.95
12.05
1
/
2
X Span Measured from Centerline
D1
19.90
20.0
20.10
X body Size
E
17.70
17.90
18.10
Y Span
E/2
8.85
8.95
9.05
1
/
2
Y Span Measured from Centerline
E1
13.90
14.00
14.10
Y body Size
H
~
~
~
Lead Frame Thickness
L
0.73
0.88
1.03
Lead Foot Length
L1
~
1.95
~
Lead Length
e
0.5 Basic
Lead Pitch
q
0
o
~
7
o
Lead Foot Angle
W
0.10
~
0.30
Lead Width
R1
0.13
~
~
Lead Shoulder Radius
R2
0.13
~
0.30
Lead Foot Radius
ccc
~
~
0.0762
Coplanarity (Assemblers)
ccc
~
~
0.08
Coplanarity (Test House)