Chapter 15 package outlines, Table 15.1 128 pin tqfp package parameters, Datasheet – SMSC LAN91C111 User Manual
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Datasheet
Revision 1.91 (08-18-08)
126
SMSC LAN91C111 REV C
DATASHEET
Chapter 15 Package Outlines
Notes:
1.
Controlling Unit: millimeter
2.
Tolerance on the position of the leads is ± 0.035 mm maximum
3.
Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm
4.
Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane is 0.78-1.08 mm.
5.
Details of pin 1 identifier are optional but must be located within the zone indicated.
6.
Shoulder widths must conform to JEDEC MS-026 dimension 'S' of a minimum of 0.20mm.
Figure 15.1 128 Pin TQFP Package Outline, 14X14X1.0 Body
Table 15.1 128 Pin TQFP Package Parameters
MIN
NOMINAL
MAX
REMARK
A
~
~
1.20
Overall Package Height
A1
0.05
~
0.15
Standoff
A2
0.95
1.00
1.05
Body Thickness
D
15.80
16.00
16.20
X Span
D/2
7.90
8.00
8.10
1
/
2
X Span Measure from Centerline
D1
13.80
14.00
14.20
X body Size
E
15.80
16.00
16.20
Y Span
E/2
7.90
8.00
8.10
1
/
2
Y Span Measure from Centerline
E1
13.80
14.00
14.20
Y body Size
H
0.09
~
0.20
Lead Frame Thickness
L
0.45
0.60
0.75
Lead Foot Length from Centerline
L1
~
1.00
~
Lead Length
e
0.40 Basic
Lead Pitch
q
0
o
~
7
o
Lead Foot Angle
W
0.13
0.18
0.23
Lead Width
R1
0.08
~
~
Lead Shoulder Radius
R2
0.08
~
0.20
Lead Foot Radius
ccc
~
~
0.0762
Coplanarity (Assemblers)
ccc
~
~
0.08
Coplanarity (Test House)