ADLINK cPCI-3970 Series - Manual (Page 36)

22 Specifications
2.6 Thermal Requirements
Cooling of the CompactPCI blade and its components is provided
by the thermal module (passive heatsink) and is dependent on suf-
ficient airflow from the chassis. The amount of thermal energy that
can by dissipated from the board is dependent on the ambient air
temperature and the airflow rate of the chassis. Please refer to the
separate document cPCI-3970 Power Dissipation Guidelines
which gives information on the upper limits of operating conditions
and the maximum ambient air temperature as a function of airflow
rate for a given level of power consumption for the cPCI-3970
blade.