Calculating backplane, Determine i/o chassis addressing mode, Determining module location in the i/o chassis – Rockwell Automation 1771-TCM,D17716.5.108 TEMPERATURE CONTROL MOD User Manual
Page 14: Determining remote termination panel location, Plan for sufficient enclosure depth

Installing the Module
Chapter 2
2-2
Your module receives its power through the 1771 I/O chassis backplane
from the chassis power supply. The maximum backplane current load of
the module is 1A.
Add this load to the loads of all other modules in the I/O chassis. This
total must not exceed the chassis backplane or backplane power supply
load specification.
Because the 1771-TCM module has a 16-I/O-bit density, you cannot use it
in an I/O chassis set for 2-slot addressing. The 1771-TCM module is
compatible with either 1-slot or
1
@
2
-slot addressing.
The extreme left slot is not an I/O module slot; it is reserved for processors
or adapter modules.
If you are using
1
@
2
-slot addressing, you can place your module into any
I/O module slot of the I/O chassis.
If you are using 1-slot addressing, do not place the 1771-TCM module
into the same even/odd module-slot pair as a 32-bit-density module.
This module uses 2 bytes in the input image table and 2 bytes in the
output image table.
To minimize electrical noise interference, group analog and low-voltage
dc digital modules away from ac modules or high voltage dc digital
modules.
Place your 1771-RTP1 remote termination panel within sufficiently close
proximity to the module so that the distance is within the length of the
interconnect cables you choose.
The length of the 1771-NC6 cable is 1.8m (6 feet).
The length of the 1771-NC15 cable is 4.6m (15 feet).
The cable connector sticks out from the front of the module. The
enclosure must provide room for a total of 215 mm (8.5 inches) from the
back-panel to the connector.
Calculating Backplane
Current Load for the
I/O Chassis
Determine I/O Chassis
Addressing Mode
Determining Module
Location in the I/O Chassis
Determining Remote
Termination Panel Location
Plan for Sufficient Enclosure
Depth