INFICON RQCM - Quartz Crystal Microbalance Research System - Manual (Page 11)

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5.3 THICKNESS CALCULATION .................................................................................................. 5-3
5.4 LIQUID MEASUREMENTS...................................................................................................... 5-5
5.4.1 DECAY LENGTH OF SHEAR WAVE IN LIQUID.............................................................. 5-8
5.5 DISSIPATION METHOD........................................................................................................... 5-9
5.6 ELECTRICAL DESCRIPTION OF THE QUARTZ CRYSTAL................................................ 5-9
5.7 CHARACTERIZING THE CRYSTAL MEASUREMENT...................................................... 5-15
5.7.1 FREQUENCY ERRORS..................................................................................................... 5-16
5.7.2 FREQUENCY ERROR DUE TO PHASE ERROR............................................................. 5-16
5.7.3 FREQUENCY ERROR DUE TO IMPERFECT CAPACITANCE CANCELLATION........ 5-17
5.8 FREQUENCY ERRORS DUE TO IMPERFECT CAPACITANCE CANCELLATION ......... 5-18
5.9 CALCULATING CRYSTAL POWER ..................................................................................... 5-19
6 APPLICATIONS.................................................................................................................... 6-1
6.1 ELECTROCHEMICAL QUARTZ CRYSTAL MICROBALANCE.......................................... 6-1
6.1.1 CALIBRATION .................................................................................................................... 6-1
6.1.2 POLYMER MODIFIED ELECTRODES ............................................................................. 6-2
6.2 CHEMICAL AND BIOLOGICAL SENSORS............................................................................ 6-2
7 COMPUTER INTERFACE .................................................................................................... 7-1
7.1 COMPUTER INTERFACE SOFTWARE................................................................................... 7-1
7.2 RECOMMENDED MINIMUM COMPUTER CONFIGURATION .......................................... 7-1
7.3 SOFTWARE INSTALLATION.................................................................................................. 7-1
7.4 CREATING YOUR OWN SOFTWARE .................................................................................... 7-1
7.5 RS-232 SERIAL INTERFACE ................................................................................................... 7-1
7.6 RS-485 SERIAL INTERFACE ................................................................................................... 7-2
7.7 IEEE-488 PARALLEL INTERFACE ......................................................................................... 7-3
7.8 PROTOCOL................................................................................................................................ 7-4
7.9 DATA TYPES............................................................................................................................. 7-4
7.10 MESSAGE RECEIVED STATUS .............................................................................................. 7-4
7.11 INSTRUCTION SUMMARY ..................................................................................................... 7-5
7.12 INSTRUCTION DESCRIPTIONS.............................................................................................. 7-5
8 DATA ACQUISITION CARD (OPTIONAL) .......................................................................... 8-1
8.1 VOLTAGE INPUTS ................................................................................................................... 8-1
8.2 TEMPERATURE INPUTS ......................................................................................................... 8-2
8.2.1 THERMISTOR INPUT......................................................................................................... 8-2
8.2.2 RTD INPUT ......................................................................................................................... 8-2
8.2.3 THERMOCOUPLE INPUT ................................................................................................. 8-2
8.3 GROUNDING CONSIDERATION............................................................................................ 8-3
8.3.1 VOLTAGE MEASUREMENT GROUNDING...................................................................... 8-3
8.3.2 TEMPERATURE MEASUREMENT GROUNDING............................................................ 8-3
9 I/O CARD (OPTIONAL) ........................................................................................................ 9-1
10 TROUBLESHOOTING GUIDE........................................................................................ 10-1
11 GLOSSARY..................................................................................................................... 11-1
12 REFERENCES ................................................................................................................ 12-1