Toshiba M30 User Manual
Page 38
1-8
User's Manual
I
NTRODUCTION
System automatic
This feature automatically shuts down the system in
Standby/Hibernation
standby mode or Hibernation mode when there is no input
or hardware access for a time specified. You can specify
the time and select either System Standby or System
Hibernate in the System standby and System hibernate
item of the Power Save Mode window in TOSHIBA Power
Saver.
Keypad overlay
A ten-key pad is integrated into the keyboard. Refer to the
section in Chapter 5, The Keyboard, for
instructions on using the keypad overlay.
Power on password
Two levels of password security, supervisor and user, are
available to prevent unauthorized access to your computer.
Instant security
A hot key function blanks the screen and disables the
computer providing data security.
Intelligent
A microprocessor in the computer’s intelligent power
power supply
supply detects the battery’s charge and calculates the
remaining battery capacity. It also protects electronic
components from abnormal conditions, such as voltage
overload from a universal AC adaptor. You can monitor
remaining battery capacity. Use the Battery remaining item
of the Power Save Modes window in TOSHIBA Power
Saver.
Battery save mode
This feature lets you save battery power. You can specify
the Power Save Mode in the Running on batteries item of
the Power Save Modes window in TOSHIBA Power Saver.
Panel power on/off
This feature turns power to the computer off when the
display panel is closed and turns it back on when the panel
is opened. You can specify the setting in the When I close
the lid item of the System Power Mode window in
TOSHIBA Power Saver.
Low battery
When battery power is exhausted to the point that
automatic hibernation
computer operation cannot be continued, the system
automatically enters Hibernation and shuts down. You can
specify the setting in the Battery Alarm item of the Alarm
window in TOSHIBA Power Saver.
Heat dispersal
The CPU has an internal temperature sensor that automati-
cally activates cooling procedures. Refer to the
section in Chapter 4, Operating Basics, for
details on setting the options for cooling methods.