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8 power sequencing – Texas Instruments TMS320F2802 User Manual

Page 106

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C4

C3

XCLKOUT

(B)

XCLKIN

(A)

C5

C9

C10

C1

C8

C6

TMS320F2809, TMS320F2808, TMS320F2806
TMS320F2802, TMS320F2801, TMS320C2802
TMS320C2801, TMS320F28016, TMS320F28015

SPRS230N – OCTOBER 2003 – REVISED MAY 2012

www.ti.com

A.

The relationship of XCLKIN to XCLKOUT depends on the divide factor chosen. The waveform relationship shown is
intended to illustrate the timing parameters only and may differ based on actual configuration.

B.

XCLKOUT configured to reflect SYSCLKOUT.

Figure 6-7. Clock Timing

6.8

Power Sequencing

No requirements are placed on the power up/down sequence of the various power pins to ensure the
correct reset state for all the modules. However, if the 3.3-V transistors in the level shifting output buffers
of the I/O pins are powered prior to the 1.8-V transistors, it is possible for the output buffers to turn on,
causing a glitch to occur on the pin during power up. To avoid this behavior, power the V

DD

(core voltage)

pins prior to or simultaneously with the V

DDIO

(input/output voltage) pins, ensuring that the V

DD

pins have

reached 0.7 V before the V

DDIO

pins reach 0.7 V.

There are some requirements on the XRS pin:

1. During power up, the XRS pin must be held low for t

w(RSL1)

after the input clock is stable (see

Table 6-

13

). This is to enable the entire device to start from a known condition.

2. During power down, the XRS pin must be pulled low at least 8

μ

s prior to V

DD

reaching 1.5 V. This is to

enhance flash reliability.

No voltage larger than a diode drop (0.7 V) above V

DDIO

should be applied to any digital pin (for analog

pins, it is 0.7 V above V

DDA

) prior to powering up the device. Furthermore, V

DDIO

and V

DDA

should always

be within 0.3 V of each other. Voltages applied to pins on an unpowered device can bias internal p-n
junctions in unintended ways and produce unpredictable results.

6.8.1

Power Management and Supervisory Circuit Solutions

Table 6-12

lists the power management and supervisory circuit solutions for 280x DSPs. LDO selection

depends on the total power consumed in the end application. Go to

http://www.power.ti.com

for a

complete list of TI power ICs.

Table 6-12. Power Management and Supervisory Circuit Solutions

SUPPLIER

TYPE

PART

DESCRIPTION

Texas Instruments

LDO

TPS767D301

Dual 1-A low-dropout regulator (LDO) with supply voltage supervisor (SVS)

Texas Instruments

LDO

TPS70202

Dual 500/250-mA LDO with SVS

Texas Instruments

LDO

TPS766xx

250-mA LDO with PG

Texas Instruments

SVS

TPS3808

Open Drain SVS with programmable delay

Texas Instruments

SVS

TPS3803

Low-cost Open-drain SVS with 5

μ

S delay

Texas Instruments

LDO

TPS799xx

200-mA LDO in WCSP package

Texas Instruments

LDO

TPS736xx

400-mA LDO with 40 mV of V

DO

Texas Instruments

DC/DC

TPS62110

High V

in

1.2-A dc/dc converter in 4x4 QFN package

Texas Instruments

DC/DC

TPS6230x

500-mA converter in WCSP package

106

Electrical Specifications

Copyright © 2003–2012, Texas Instruments Incorporated

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