Dell Intel PRO Family of Adapters User Manual

Page 145

10 Mbps only)

1000Base-KX

Power Require-
ments

5.5 Watts (maximum) @ 3.3 V

10.1 Watts (maximum) @ 12 V

0.6 Watts @ 3.3 V (AUX),
6.3 Watts @ 1.2 V
(VCORE)

Dimensions

3.93 x 3.67 in.

4.3 x 3.7 in.

3.0 x 2.5 in.

Operating Tem-
perature

32 - 131 deg. F (0 - 55 deg. C)

32 - 131 deg. F (0 - 55
deg. C)

MTBF

68 years

65 years

147 years

Available
Speeds

2 ports at 10 Gbps/(2 ports at 1 Gbps, see
Intel® Ethernet Gigabit 4P X540/I350
rNDC)

2 ports at 10 Gbps/(2 ports at 1 Gbps, see
Intel® Ethernet Gigabit 4P X520/I350
rNDC)

10 Gbps/1 Gbps

Duplex Modes

Full only

Standards Con-
formance

IEEE 802.1p
IEEE 802.1Q
IEEE 802.3ac
IEEE 802.3ad
IEEE 802.3ae
IEEE 802.3x
ACPI v1.0
PCI Express 1.0a

IEEE 802.1p
IEEE 802.1Q
IEEE 802.3ac
IEEE 802.3ad
IEEE 802.3ap
IEEE 802.3x
ACPI v1.0
PCI Express 2.0

Regulatory and
Safety

Safety Compliance

UL 60950 Third Edition- CAN/CSA-C22.2 No.60950-00 (USA/Canada)

EN 60 950 (European Union)

IEC 60 950 (International)

EMC Compliance

FCC Part 15 - Radiated & Conducted Emissions (USA)

ICES-003 - Radiated & Conducted Emissions (Canada)

CISPR 22 - Radiated & Conducted Emissions (International)

EN55022-1998 - Radiated & Conducted Emissions (European Union)

EN55024 - 1998 - (Immunity) (European Union)

CE - EMC Directive (89/336/EEC) (European Union)

VCCI - Radiated & Conducted Emissions (Japan)

CNS13438 - Radiated & Conducted Emissions (Taiwan)

AS/NZS3548 - Radiated & Conducted Emissions (Australia/New Zealand)

MIC notice 1997-41, EMI and MIC notice 1997-42 - EMS (Korea)

Feature

Intel® Ethernet 10G 4P X540/I350
rNDC

Intel® Ethernet 10G 4P X520/I350
rNDC

Intel® Ethernet 10G
2P X520-k bNDC

Bus Connector

PCI Express 2.0

Bus Speed

2 x8

Transmission
Mode/Connector

Twisted copper/RJ-45

SFP+

Copper/Backplane

Cabling

1000Base-T (Category 5 or Category 3 on
10 Mbps only)

SFP+ SR/DA

10GBase-KR and
1000Base-KX