Rockwell Automation 1771-VHSC , D17716.5.74 Very High S - Manual (Page 28)

2–2 Installing the Very High-Speed Counter Module
•
Industrial Automation Wiring and Grounding Guidelines,
publication 1770-4.1
•
Guidelines for Handling Lithium Batteries, publication AG-5.4
•
Automation Systems Catalog, publication B111
Electrostatic discharge can damage semiconductor devices inside this
module if you touch backplane connector pins. Guard against
electrostatic damage by observing the following warning:
!
ATTENTION: Electrostatic discharge can degrade
performance or cause permanent damage. Handle the
module as stated below.
•
Wear an approved wrist strap grounding device when handling
the module.
•
Touch a grounded object to rid yourself of electrostatic charge
before handling the module.
•
Handle the module from the front, away from the backplane
connector. Do not touch backplane connector pins.
•
Keep the module in its static-shield bag when not in use, or
during shipment.
Your module receives its power through the 1771 I/O chassis
backplane from the chassis power supply. The maximum current
drawn by the module from this supply is 650mA (3.25 Watts).
Add this value to the requirements of all other modules in the I/O
chassis to prevent overloading the chassis backplane and/or
backplane power supply.
Place your module in any slot of the I/O chassis except for the
extreme left slot. This slot is reserved for processors or adapter
modules.
When using: You can:
2Ćslot addressing place your module in any module group with any 8Ćbit or block
transfer module.
1Ćslot addressing place your module in any module group with any 8Ćbit, 16Ćbit or block
transfer module.
1/2Ćslot addressing, no restrictions on module location.
After determining the module’s location in the I/O chassis, connect
the wiring arm to the pivot bar at the module’s location.
Electrostatic Damage
Power Requirements
Module Location in the
I/O Chassis