Outline dimensions, Surface mount design, Adsp-ts201s – Analog Devices TigerSHARC ADSP-TS201S User Manual
Page 45
ADSP-TS201S
Rev. C
|
Page 45 of 48
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December 2006
OUTLINE DIMENSIONS
The ADSP-TS201S processor is available in a 25 mm × 25 mm,
576-ball metric thermally enhanced ball grid array (BGA_ED)
package with 24 rows of balls (BP-576).
SURFACE MOUNT DESIGN
is provided as an aid to PCB design. For industry-
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Figure 47. 576-Ball BGA_ED (BP-576)
1.00
BSC
(BALL
PITCH)
0.75
0.65
0.55
(BALL
DIAMETER)
DETAIL A
NOTES:
1. ALL DIMENSIO NS ARE IN MILL IMET ERS.
2. THE ACTUAL PO SITION OF THE BAL L GR ID IS W ITHIN 0.25 m m OF ITS
IDEAL POSITIO N RELATIVE TO THE PACKAGE EDGES.
3. CENTER DIMENSIONS ARE N OMINAL.
4. THIS PACKAG E C ONFO RMS TO JEDEC MS-034 SPECIF ICATIO N.
SEATING PLANE
1.60 MAX
0.20 MAX
DETAIL A
0.97 BSC
7
9
5
3
1
11
13
15
17
21 19
23
6
8
10
12
14
16
18
20
24 22
4
2
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
Y
W
V
U
T
AD
AC
AB
AA
23.00
BSC
SQ
25.20
25.00
24.80
25.20
25.00
24.80
TOP VIEW
BOTTOM VIEW
1.00
BSC
0.60
0.50
0.40
1.00
BSC
A1 BALL
INDICATOR
1.25
1.00
0.75
1.25
1.00
0.75
3.10
2.94
2.78
Table 36. BGA Data for Use with Surface Mount Design
Package
Ball Attach Type
Solder Mask Opening
Ball Pad Size
576-Ball BGA_ED
(BP-576)
Nonsolder Mask Defined (NSMD)
0.69 mm diameter
0.56 mm diameter