Analog Devices TigerSHARC ADSP-TS201S - Manual (Page 40)

Rev. C | Page 40 of 48 | December 2006
ADSP-TS201S
ENVIRONMENTAL CONDITIONS
The ADSP-TS201S processor is rated for performance under
T
CASE
environmental conditions specified in the Operating Con-
ditions on Page 21 .
Thermal Characteristics
The ADSP-TS201S processor is packaged in a 25 mm × 25 mm,
thermally enhanced ball grid array (BGA_ED). The
ADSP-TS201S processor is specified for a case temperature
(T
CASE
). To ensure that the T
CASE
data sheet specification is not
exceeded, a heat sink and/or an air flow source may be required.
Table 34 shows the thermal characteristics of the 25 mm ×
25 mm BGA_ED package. All parameters are based on a
JESD51-9 four-layer 2s2p board. All data are based on 3 W
power dissipation.
Table 34. Thermal Characteristics for 25 mm × 25 mm
Package
Parameter Condition Typical Unit
θ
JA
1
1 θ
JA
measured per JEDEC standard JESD51-6.
Airflow = 0 m/s 12.9 2
2 θ
JA
= 12.9°C/W for 0 m/s is for vertically mounted boards. For horizontally
mounted boards, use 17.0°C/W for 0 m/s.
°C/W
Airflow = 1 m/s 10.2 °C/W
Airflow = 2 m/s 9.0 °C/W
Airflow = 3 m/s 8.0 °C/W
θ
JB
3
3 θ
JB
measured per JEDEC standard JESD51-9.
— 7.7 °C/W
θ
JC
4
4 θ
JC
measured by cold plate test method (no approved JEDEC standard).
— 0.7 °C/W