Intel OCPRF100 MP - Manual (Page 26)

OCPRF100 MP Server System Technical Product Specification
Revision 1.0
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Figure 3-2: OPRF100 Board Set/System Board Locations within Server Chassis
The peripheral bay mounted at the lower front of the chassis supports a 3.5-inch floppy drive, a
half-height 5.25-inch device (e.g., CD-ROM) and two 3.5-inch by 1.0- or 1.6-inch hot-swap hard
drives. SCSI drives in the hot-swap hard drive bays can be hot-swapped without shutting down
the server.
The chassis supports up to three hot-swap, redundant power supplies in a 2+1 configuration.
These supplies provide redundant and hot-swappable cooling to the memory carriers and periph-
erals when the power supplies are in a redundant configuration. A cover plate for the unoccupied
power supply location is supplied for systems without redundancy, and should be used to provide
adequate cooling and EMI shielding.
The system design provides a hot-swap, redundant (5+1) cooling system for the Profusion and I/
O carriers. Basic controls and indicators are located on the front panel.
The front bezel can be customized for integrators to meet their industrial design requirements.
The front bezel contains openings to provide adequate cooling for the chassis components and
access to the peripherals.
Figure 3-3: OCPRF100 MP Server System Chassis Block Diagram shows a block diagram of the
server system.
Profusion Carrier
I/O Carrier
Midplane
Memory Carriers
Power Supplies
Front Panel
I/O Riser Board