Ordering information, Package handling – Cypress enCoRe CY7C63310 User Manual
Page 75
CY7C63310, CY7C638xx
Document 38-08035 Rev. *K
Page 75 of 83
29. Ordering Information
Ordering Code
FLASH Size
RAM Size
Package Type
CY7C63310-PXC
3K
128
16-PDIP
CY7C63310-SXC
3K
128
16-SOIC
CY7C63801-PXC
4K
256
16-PDIP
CY7C63801-SXC
4K
256
16-SOIC
CY7C63803-SXC
8K
256
16-SOIC
CY7C63803-SXCT
8K
256
16-SOIC, Tape and Reel
CY7C63813-PXC
8K
256
18-PDIP
CY7C63813-SXC
8K
256
18-SOIC
CY7C63823-QXC
8K
256
24-QSOP
CY7C63823-SXC
8K
256
24-SOIC
CY7C63823-SXCT
8K
256
24-SOIC, Tape and Reel
CY7C63823-XC
8K
256
Die form
CY7C63833-LFXC
8K
256
32-QFN
CY7C63833-LTXC 8K
256
32-QFN
Sawn
CY7C63833-LTXCT
8K
256
32-QFN Sawn, Tape and Reel
30. Package Handling
Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving
the factory. A label on the packaging has details about actual bake temperature and the minimum bake time to remove this moisture.
The maximum bake time is the aggregate time that the parts are exposed to the bake temperature. Exceeding this exposure time may
degrade device reliability.
Parameter
Description
Min
Typical
Max
Unit
T
BAKETEMP
Bake Temperature
125
See package label
°C
T
BAKETIME
Bake Time
See package label
72
hours