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Package diagrams – Cypress enCoRe CY7C602xx User Manual

Page 64

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CY7C601xx, CY7C602xx

Document 38-16016 Rev. *E

Page 64 of 68

23. Package Diagrams

Figure 23-1. 24-Pin (300-Mil) SOIC S13

Figure 23-2. 24-Pin (300-Mil) PDIP P13

PIN 1 ID

SEATING PLANE

0.597[15.163]

0.615[15.621]

1

12

13

24

*

*

*

0.291[7.391]
0.300[7.620]

0.394[10.007]
0.419[10.642]

0.050[1.270]

TYP.

0.092[2.336]
0.105[2.667]

0.004[0.101]
0.0118[0.299]

0.0091[0.231]
0.0125[0.317]

0.015[0.381]
0.050[1.270]

0.013[0.330]
0.019[0.482]

0.026[0.660]
0.032[0.812]

0.004[0.101]

PART #

S24.3 STANDARD PKG.

SZ24.3 LEAD FREE PKG.

MIN.
MAX.

NOTE :

1. JEDEC STD REF MO-119

2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT

MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE

3. DIMENSIONS IN INCHES

4. PACKAGE WEIGHT 0.65gms

DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE.

51-85025 *C

51-85013-*B

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