22 power and thermal management, 1 speedstep technology, 2 c-state control – Kontron JRexplus-DC User Manual
Page 44: 3 hyper-threading technology, 4 fan interface

KTD-S0008-F
Page 39
Power and Thermal Management
JRexplus-DC User's Guide
22 Power and Thermal Management
22.1 SpeedStep Technology
The Intel
®
Atom processor offers the Intel
®
Enhanced SpeedStep
TM
technology that automatically switches
between maximum performance mode and battery optimized mode depending on the needs of the appli-
cation being run. When powered by a battery or running in idle mode the processor drops to lower fre-
quencies conserving battery life while maintaining a high level of performance. The previous frequency is
set back automatically when the operating mode changes.
22.2 C-State Control
The Intel
®
chipset has been implemented the control for dynamically starting and stopping system clocks
and power. The states are passing through C0 (full on) to C4 one after another. The C-state ends when a
break event occurs (e.g. an IRQ or SMI).
22.3 Hyper-Threading Technology
Intels
®
Hyper-Threading technology boosts system performance without higher clock rates or adding more
processors which is also an optimization of the power consumption. Hyper-Threading works by duplicating
instructions streams, called threads. This allows a CPU to pretend to be two logical processors on the
operating system which must support this technology. Individually the logical processors can be halted or
interrupted or can execute a thread independently of the other logical unit.
22.4 Fan Interface
If a fan is added use this interface to connect a fan to cool off the CPU. The connector only supports 5V
fans. A three pin fan includes a pulse output (sense) which allows the control of fan speed.
22.4.1 Connector
The fan interface is available through connector J29.
Header
Pin
Signal Name
Function
1
SENSE
Speed monitoring
2
VCC
1)
Power +5V
3
GND
Ground
Note:
1)
To protect the external power lines of peripheral devices make sure that
- the wires have the right diameter to withstand the maximum available current.
- the enclosure of the peripheral device fulfills the fire-protecting conditions of IEC/EN 60950.