Packages, Ball pbga package characteristics, Ball pbga package specifications – Cirrus Logic EP7311 User Manual
Page 30: Figure 15. 256-ball pbga package
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Copyright Cirrus Logic, Inc. 2011
(All Rights Reserved)
DS506F2
EP7311
High-Performance, Low-Power System on Chip
Packages
256-Ball PBGA Package Characteristics
256-Ball PBGA Package Specifications
Figure 15. 256-Ball PBGA Package
Note:
1) For pin locations see
2) Dimensions are in millimeters (inches), and controlling dimension is millimeter
3) Before beginning any new EP7311 design, contact Cirrus Logic for the latest package information.
TOP VIEW
17.00 (0.669)
15.00 (0.590)
SIDE VIEW
BOTTOM VIEW
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
1.00 (0.040)
Pin 1 Indicator
Pin 1 Corner
Pin 1 Corner
16 15 14 13 12 11 10 9 8
7
6 5
4
3
2
1
15.00 (0.590)
2 Layer
17.00 (0.669)
17.00 (0.669)
1.00 (0.040)
1.00 (0.040)
1.00 (0.040)
30° TYP
REF
REF
0.50
3 Places
0.85 (0.034)
±0.05 (.002)
0.40 (0.016)
±0.05 (.002)
0.36 (0.014)
17.00 (0.669)
R
D1
E1
D
E
±0.20 (.008)
±0.20 (.008)
±0.20 (.008)
±0.20 (.008)
±0.09 (0.004)
JEDEC #: MO-151
Ball Diameter: 0.50 mm ± 0.10 mm
17 ¥ 17 ¥ 1.61 mm body