GE Industrial Solutions HW006-010-012 Series - Manual (Page 22)

Lineage Power 22
Data Sheet
June 26, 2009
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Recommended Pad Layout for Surface-Mount Module
and Recommended Hole Layout for Through-Hole Module
Component-side footprint.
Dimensions are in millimeters and (inches), unless otherwise noted.
29.46 (1.160)
27.84 (1.096)
1.68 (0.066)
0 (0)
0 (0)
32.56 (1.282)
20.73 (0.816)
0 (0)
0 (0) 3.63 (0.143
)
8.64 (0.340
)
38.63 (1.52
1)
43.64 (1.71
8)
47.24 (1.86
0)
NOTES:
1. FOR CGA SURFACE MOUNT PIN
USE THE FOLLOWING PAD
0.022" DIA VIA
0.032" DIA SOLDER MASK OPENING
4 PLACES FOR OUTPUT PINS
2 PLACES FOR INPUT PINS
0.025" SPACING VIA TO PAD
0.015" MIN SOLDER MASK WALL
0.105" PASTE MASK OPENING
0.110" SOLDER MASK OPENING
KEEP-OUT AREA:
Besides trace to ON/OFF pin,
do not route other traces on the
PWB top layer closest to the
power module in this keep-out area.