OSRAM PrevaLED Core Z2 - Manual (Page 15)

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4. Thermal considerations
THERMAL CONSIDERATIONS
Additional partners for thermal management support can
also be found in OSRAM’s LED Light For You network:
www.ledlightforyou.com .
The proper thermal design of an LED luminaire is critical
for achieving the best performance and ensuring the long
lifetime of all components. Because the PrevaLED
® Core
Z2 ensures high effi ciencies, only a partial amount of the
introduced electrical power still has to be dissipated
through the back of the light engine (see also:
1.2.2. Tech-
nical data (p. 7) ).
Depending on the application and the chosen LED
module, passive cooling can be suffi cient. In critical appli-
cations (e.g. small available heat sink size in combination
with high-power LED modules), active cooling by means
of a ventilator may be needed. Active cooling combines a
heat sink with a fan or a similar device to maximize the
cooling power out of an existing, passive heat sink.
4.1. Thermal interface material and other accessories
When mounting a PrevaLED
® Core Z2 within a luminaire,
it is highly recommended to use thermal interface material
(TIM) between the back of the LED module and the lumi-
naire housing. Either heat-conductive paste or foil can be
used. In order to balance possible unevenness, the materi-
al should be applied as thinly as possible, but as thickly as
necessary. In this way, air inclusions, which may otherwise
occur, are replaced by TIM and the required heat conduc-
tion between the back of the LED module and the contact
surfaces of the luminaire housing are achieved. For this
purpose, the planarity and roughness of the surface
should be optimized.
For initial application designs, applicably pre-pierced ther-
mal interface material (e.g. Kerafol’s Keratherm 86-82) with
a diameter of 50 mm and matching mounting holes can
be ordered through the Alfatec company (see the partner
information below). The list below shows a selection of
suppliers of passive and active cooling solutions as well
as thermal interface materials.
Active cooling systems:
AVC www.avc-europa.de
Cooler Master
www.coolermaster.com
Nuventix www.nuventix.com
Sunon www.sunoneurope.com
Heat sinks:
Aavid Thermalloy www.aavidthermalloy.com
Cool Innovations www.coolinnovations.com
Fischer Elektronik www.fi scherelektronik.de
Meccal www.meccal.com
Pinbloc www.pinbloc.de
Radian www.radianheatsinks.com
R-Theta www.r-theta.com
Wakefi eld
www.wakefi eld.com
Thermal interface materials:
Aavid Thermalloy www.aavidthermalloy.com
Alfatec www.alfatec.de
Arctic Silver
www.arcticsilver.com
Bergquist www.bergquistcompany.com
Chomerics www.chomerics.com
Dow Corning
www.dowcorning.com
Electrolube www.electrolube.com
Kerafol www.kerafol.de
Kester www.kester.com
Kunze Folien
www.heatmanagement.com
Laird www.lairdtech.com
MG Chemicals
www.mgchemicals.com
Thermafl o www.thermafl o.com
Thermagon www.thermagon.com
Wakefi eld
www.wakefi eld.com
Heat pipes:
DAU www.dau-at.com
MB Electronic AG
www.mb-electronic.de
Simulation software:
Comsol www.comsol.de
Flotherm www.mentor.com
SolidWorks www.solidworks.com
Thermal probes/thermocouples:
B+B Thermo-Technik www.bubthermo.de
OMEGA www.omega.de