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Rainbow Electronics MAX17409 User Manual

Page 29

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MAX17409

1-Phase Quick-PWM GPU Controller

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29

driver can supply sufficient current to support the gate
charge and the current injected into the parasitic gate-
to-drain capacitor caused by the high-side MOSFET
turning on; otherwise, cross-conduction problems could
occur (see the

MOSFET Gate Drivers

section).

MOSFET Power Dissipation

Worst-case conduction losses occur in the high-side
MOSFET (N

H

) is a function of the duty factor, with the

worst-case power dissipation occurring at the minimum
input voltage:

Generally, a small high-side MOSFET is desired to
reduce switching losses at high input voltages.
However, the R

DS(ON)

required to stay within package

power dissipation often limits how small the MOSFET
can be. Again, the optimum occurs when the switching
losses equal the conduction (R

DS(ON)

) losses. High-

side switching losses do not usually become an issue
until the input is greater than approximately 15V.

Calculating the switching losses in a high-side MOSFET
(N

H

) is difficult since it must allow for difficult quantify-

ing factors that influence the turn-on and turn-off times.
These factors include the internal gate resistance, gate
charge, threshold voltage, source inductance, and PCB
layout characteristics. The following switching-loss cal-
culation provides only a very rough estimate and is no
substitute for breadboard evaluation, preferably includ-
ing verification using a thermocouple mounted on N

H

:

where C

OSS

is the N

H

MOSFET’s output capacitance,

Q

G(SW)

is the charge needed to turn on the N

H

MOSFET,

and I

GATE

is the peak gate-drive source/sink current

(2.2A typ).

Switching losses in the high-side MOSFET can become
an insidious heat problem when maximum AC adapter
voltages are applied, due to the squared term in the C
x V

IN

2

x f

SW

switching-loss equation. If the high-side

MOSFET chosen for adequate R

DS(ON)

at low battery

voltages becomes extraordinarily hot when biased from
V

IN(MAX)

, consider choosing another MOSFET with

lower parasitic capacitance.

For the low-side MOSFET (N

L

), the worst-case power

dissipation always occurs at maximum input voltage:

The worst case for MOSFET power dissipation occurs
under heavy overloads that are greater than
I

LOAD(MAX)

, but are not quite high enough to exceed

the current limit and cause the fault latch to trip. To pro-
tect against this possibility, the circuit can be overde-
signed to tolerate:

where I

VALLEY(MAX)

is the maximum valley current

allowed by the current-limit circuit, including threshold
tolerance and on-resistance variation. The MOSFETs
must have a good size heatsink to handle the overload
power dissipation.

Choose a Schottky diode (D

L

) with a forward voltage

low enough to prevent the low-side MOSFET body
diode from turning on during the dead time. Select a
diode that can handle the load current during the dead
times. This diode is optional and can be removed if effi-
ciency is not critical.

Boost Capacitors

The boost capacitors (C

BST

) must be selected large

enough to handle the gate charging requirements of
the high-side MOSFETs. However, high-current appli-
cations driving large high-side MOSFETS require boost
capacitors larger than 0.1µF. For these applications,
select the boost capacitors to avoid discharging the
capacitor more than 200mV while charging the high-
side MOSFETs’ gates:

where N is the number of high-side MOSFETs used for
one regulator, and Q

GATE

is the gate charge specified

in the MOSFET’s data sheet. For example, assume (2)
IRF7811W n-channel MOSFETs are used on the high
side. According to the manufacturer’s data sheet, a sin-
gle IRF7811W has a maximum gate charge of 24nC
(V

GS

= 5V). Using the above equation, the required

boost capacitance would be:

Selecting the closest standard value, this example
requires a 0.22µF ceramic capacitor.

C

nC

mV

µF

BST

= ×

=

2

24

200

0 24

.

C

N Q

mV

BST

GATE

=

×

200

I

I

I

LOAD

VALLEY MAX

INDUCTOR

=

+


⎝⎜


⎠⎟

(

)

2

(

)

(

)

=

+


⎝⎜


⎠⎟

I

I

LIR

VALLEY MAX

LOAD MAX

2

PD (NL Resistive) = 1-

V

V

OUT

IN MAX

(

)



⎤⎤

(

)

I

R

LOAD

DS ON

2

(

)

PD (NH Switching) = V I

f

Q

I

IN LOAD SW

G SW

GATE

(

)


⎝⎝⎜


⎠⎟

+

C

V

OSS IN

2

2

2

f

SW

PD (NH Resistive) =

V

V

I

R

OUT

IN

LOAD

DS


⎝⎜


⎠⎟

2

(O

ON)