Package thermal specifications – Intel 80L186EA User Manual
Page 20
80C186EA 80C188EA 80L186EA 80L188EA
272432 – 7
Figure 7 Shrink Quad Flat Pack (SQFP) Pinout Diagram
NOTES
1 XXXXXXXXD indicates the Intel FPO number
2 Pin names in parentheses apply to the 80C188EA
PACKAGE THERMAL
SPECIFICATIONS
The 80C186EA 80L186EA is specified for operation
when T
C
(the case temperature) is within the range
of 0 C to 85 C (PLCC package) or 0 C to 106 C
(QFP-EIAJ) package T
C
may be measured in any
environment to determine whether the processor is
within the specified operating range The case tem-
perature must be measured at the center of the top
surface
T
A
(the ambient temperature) can be calculated
from i
CA
(thermal resistance from the case to ambi-
ent) with the following equation
T
A
e
T
C
- P
c
i
CA
Typical values for i
CA
at various airflows are given
in Table 10
P (the maximum power consumption specified in
watts) is calculated by using the maximum ICC as
tabulated in the DC specifications and V
CC
of 5 5V
Table 10 Thermal Resistance (i
CA
) at Various Airflows (in C Watt)
Airflow Linear ft min (m sec)
0
200
400
600
800
1000
(0) (1 01) (2 03) (3 04) (4 06) (5 07)
i
CA
(PLCC)
29
25
21
19
17
16 5
i
CA
(QFP)
66
63
60 5
59
58
57
i
CA
(SQFP)
70
20
20