Digilent 410-292P-KIT User Manual
Page 29
Nexys4 DDR™ FPGA Board Reference Manual
Copyright Digilent, Inc. All rights reserved.
Other product and company names mentioned may be trademarks of their respective owners.
Page 29 of 29
Stressed solder joints can be repaired by reheating and reflowing solder and contaminants can be cleaned with off-
the-shelf electronics cleaning products. If a board fails test within the warranty period, it will be replaced at no
cost. Contact Digilent for more details.
See also other documents in the category Digilent Hardware:
- 410-282P-KIT (4 pages)
- 410-279P-KIT (26 pages)
- 410-258P-KIT (16 pages)
- 410-138P-KIT (28 pages)
- 410-178P-KIT (22 pages)
- 410-274P-KIT (29 pages)
- 410-182P-KIT (22 pages)
- 410-134P-KIT (17 pages)
- 410-183P-KIT (19 pages)
- 410-155P-KIT (12 pages)
- 6015-410-001P-KIT (26 pages)
- 410-087P-KIT (164 pages)
- 410-146P-KIT (4 pages)
- 6003-410-000P-KIT (138 pages)
- XUPV2P (23 pages)
- 410-047-C2P-KIT (3 pages)
- WaveForms (85 pages)
- 410-297P-KIT (25 pages)
- 410-295P-KIT (37 pages)
- 410-296P-KIT (23 pages)
- 410-209P-KIT REV.D (16 pages)
- 410-209P-KIT REV.C (17 pages)
- 410-254P-KIT (17 pages)
- 410-280P-KIT (9 pages)
- 410-202P-KIT (20 pages)
- 410-273P-KIT (24 pages)
- 410-269P-KIT (11 pages)
- 410-216P-KIT (15 pages)
- 410-231P-KIT (4 pages)
- 410-211P-KIT (10 pages)
- 410-262P-KIT (8 pages)
- 410-229P (7 pages)
- 410-242P-KIT (4 pages)
- 6021-210-000P-KIT (27 pages)
- 410-185P-KIT (21 pages)
- 6032-410-000P-BOARD (4 pages)
- 410-174P (17 pages)
- 410-145P (6 pages)
- 210-264P-BOARD (3 pages)
- 6003-210-012P (27 pages)
- 410-236P-BOARD (2 pages)
- 410-163P (1 page)
- 410-097P-KIT (2 pages)
- 410-255P-KIT (1 page)