Rockwell Automation System Design for the Control of Electrical Noise - Manual (Page 27)

Publication GMC-RM001A-EN-P — July 2001
High Frequency (HF) Bonding 2-9
Grid and Raised Floor
Bonding cabinet panels and machine chassis to a ground grid below a
raised floor is the best possible grounding scheme and commonly
used in computer mainframe installations, but rarely used in industrial
environments.
Ideally the grid squares should be 1 m (39 in.) or less.
Figure 2.7
Panel ground plane extended to a grid beneath a raised floor
Grid ground plane.
Copper strip laid on the floor,
covered by a false floor
(also bonded to machine structure).
Cabinet ground plane (panel)
bonded to floor ground plane
Machine structure used as ground plane