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4 power supply characteristics, 5 thermal data (100-pin lqfp with exposed pad), 6 digital switching characteristics-reset – Cirrus Logic CS470xx User Manual

Page 13: 6 digital switching characteristics–reset

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13

DS787PP9

5.4 Power Supply Characteristics

5.4 Power Supply Characteristics

Note:

Measurements performed under operating conditions

1. Dependent on application firmware and DSP clock speed.

5.5 Thermal Data (100-pin LQFP with Exposed Pad)

1. To calculate the die temperature for a given power dissipation:

j

= Ambient temperature + [ (Power Dissipation in Watts) *

ja

]

2. To calculate the case temperature for a given power dissipation:

c

=

j

- [ (Power Dissipation in Watts) *

jt

]

Note:

Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20%
of the top and bottom layers.

Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20% of the
top and bottom layers and 0.5-oz. copper covering 90% of the internal power plane and ground plane layers.

5.6 Digital

Switching

Characteristics–RESET

1. The rising edge of RESET must not occur before the power supplies are stable at the recommended operating values as described in

Section 5.2

. In

addition, for the configuration pins to be read correctly, the RESET T

rstl

requirement must be met.

Parameter

Min Typ Max Unit

Operational Power Supply Current:
VDD: Core and I/O operating

1

VDDA: PLL operating current
VDDA: DAC operating current (all 8 channels enabled)
VDDA: ADC operating current (all 4 channels enabled)
VDDIO: With most ports operating

Total Operational Power Dissipation:

Standby Power Supply Current:
VDD: Core and I/O not clocked
VDDA: PLLs halted
VDDA: DAC disabled
VDDA: ADC disabled
VDDIO: All connected I/O pins 3-stated by other ICs in system

Total Standby Power Dissipation:









325

16
56
34
27

1025

410

26
40
24

215

1745









mA
mA
mA
mA
mA

mW

μA

μA

μA

μA

μA

μW

Parameter

Symbol Min

Typ

Max

Unit

Thermal Resistance (Junction to Ambient)
Two-layer Board

1

Four-layer Board

2

ja


34
18


°C/Watt

Thermal Resistance (Junction to Top of Package)
Two-layer Board

1

Four-layer Board

2

jt


0.54
.28


°C/Watt

Parameter

Symbol Min Max Unit

RESET minimum pulse width low

1

T

rstl

1

s

All bidirectional pins high-Z after RESET low

T

rst2z

200

ns

Configuration pins setup before RESET high

T

rstsu

50

ns

Configuration pins hold after RESET high

T

rsthld

20

ns