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3 mechanical design, 1 probe footprints, Echanical – Teledyne LeCroy PCI Express 2.0 Mid-Bus Probe Ver.2.40 User Manual

Page 8: Esign, Probe footprints

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Teledyne LeCroy

PCIe 2.0 Mid-Bus Probe Installation Guide

Version 2.4

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3 Mechanical Design

This section describes footprint dimensions, keepout volumes, and probe pin assignments.

3.1 Probe Footprints

The Mid-bus Probe is fully compatible with the standardized mid-bus footprint recommended by the Intel
guideline, as shown in the following figures.

See also other documents in the category Teledyne LeCroy Equipment: