GE Industrial Solutions KBVW006A0B Series - Manual (Page 11)

GE
Data Sheet
KBVW006A0B Series Sixteenth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 6A Output Current
July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 11
Figure 20. Recommended linear reflow profile using
Sn/Ag/Cu solder.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant, Z option, through-hole products
use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-
compliant components. They are designed to be
processed through single or dual wave soldering
machines. The pins have a RoHS-compliant, pure tin
finish that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of 3C/s is
suggested. The wave preheat process should be such
that the temperature of the power module board is kept
below 210C. For Pb solder, the recommended pot
temperature is 260C, while the Pb-free solder pot is
270C max.
Reflow Lead-Free Soldering Information
The RoHS-compliant through-hole products (with the
exception of modules that come with heat plate option –
H) can be processed with the following paste-through-
hole Pb or Pb-free reflow process.
Max. sustain temperature:
245C (J-STD-020C Table 4-2: Packaging
Thickness>=2.5
mm / Volume > 2000 mm 3 ),
Peak temperature over 245C is not suggested due to
the potential reliability risk of components under
continuous high-temperature.
Min. sustain duration above 217C: 90 seconds
Min. sustain duration above 180C: 150 seconds
Max. heat up rate: 3C/sec
Max. cool down rate: 4C/sec
In compliance with JEDEC J-STD-020C spec for 2 times
reflow requirement.
Pb-free Reflow Profile
BMP module (with the exception of modules that come
with heat plate option –H) will comply with J-STD-020
Rev. C (Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for both
Pb-free solder profiles and MSL classification
procedures. BMP will comply with JEDEC J-STD-020C
specification for 3 times reflow requirement. The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The
recommended linear reflow profile using Sn/Ag/Cu
solder is shown in Figure 21.
Time
T
e
m
p
Ramp up
max. 3 °C/Sec
Ramp down
max. 4 °C/Sec
Time Limited 90 Sec.
above 217°C
Preheat time
100-150 Sec.
Peak Temp. 240 -245 °C
25 °C
150 °C
200 °C
217 °C
Figure 21. Recommended linear reflow profile using
Sn/Ag/Cu solder.
MSL Rating
The modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices). Moisture Barrier Bags (MBB)
with desiccant are required for MSL ratings of 2 or
greater. These sealed packages should not be broken
until time of use. Once the original package is broken,
the floor life of the product at conditions of  30°C and
60% relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed SMT
packages will be a minimum of 12 months from the bag
seal date, when stored at the following conditions: < 40°
C, < 90% relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of
the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001)