GE Industrial Solutions KBVW006A0B Series - Manual (Page 10)

GE
Data Sheet
KBVW006A0B Series Sixteenth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 6A Output Current
July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 10
Surface Mount Information
Pick and Place
The modules use an open frame construction and are
designed for a fully automated assembly process. The
modules are fitted with a label designed to provide a
large surface area for pick and place operations. The
label meets all the requirements for surface mount
processing, as well as safety standards, and is able to
withstand reflow temperatures of up to 300
o C. The label
also carries product information such as product code,
serial number and the location of manufacture.
Figure 17. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these modules
have a relatively large mass when compared to
conventional SMT components. Variables such as nozzle
size, tip style, vacuum pressure and placement speed
should be considered to optimize this process. The
minimum recommended nozzle diameter for reliable
operation is 6mm. The maximum nozzle outer diameter,
which will safely fit within the allowable component
spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Tin Lead Soldering
The power modules are lead free modules and can be
soldered either in a lead-free solder process or in a
conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets in
order to customize the solder reflow profile for each
application board assembly. The following instructions
must be observed when soldering these units. Failure to
observe these instructions may result in the failure of or
cause damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak
reflow temperatures are limited to less than 235 o C (see
Fig 18). Typically, the eutectic solder melts at 183 o C,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse the
plating on the connection to ensure a reliable solder
joint. There are several types of SMT reflow technologies
currently used in the industry. These surface mount
power modules can be reliably soldered using natural
forced convection, IR (radiant infrared), or a combination
of convection/IR. For reliable soldering the solder reflow
profile should be established by accurately measuring
the modules CP connector temperatures.
RE
FLOW TEM
P (
C)
REFLOW TIME (S)
Figure 18. Reflow Profile for Tin/Lead (Sn/Pb) process
MAX T
EMP
SO
LDE
R (
C)
Figure 19. Time Limit Curve Above 205 o C for Tin/Lead
(Sn/Pb) process
Lead Free Soldering
The –Z version of the modules are lead-free (Pb-free) and
RoHS compliant and are both forward and backward
compatible in a Pb-free and a SnPb soldering process.
Failure to observe the instructions below may result in
the failure of or cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Modules (with the exception of modules that
come with heat plate option –H) will comply with J-STD-
020 Rev. C (Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for both
Pb-free solder profiles and MSL classification procedures.
This standard provides a recommended forced-air-
convection reflow profile based on the volume and
thickness of the package (Table 4-2). The suggested Pb-
free solder paste is Sn/Ag/Cu (SAC). The recommended
linear reflow profile using Sn/Ag/Cu solder is shown in
Figure 21.
0
50
100
150
200
250
300
Preheat zo ne
max 4
o Cs -1
Soak zone
30-240s
Heat zo ne
max 4
o Cs -1
Peak Temp 235 o C
Coo ling
zone
1-4
o Cs -1
T
lim
above
205 o C
200
205
210
215
220
225
230
235
240
0 10 20 30 40 50 60