GE Industrial Solutions Zephyr Non-Isolated SMT - Manual (Page 26)

Zephyr Non-Isolated SMT DC-DC Power Module:
0.8V to 3.5V @ 20A Output, 5V to 12V Input Data Sheet
March 31, 2010
Surface Mount Information
Pick and Place
The Zephyr SMT modules use an open frame construction and are designed for a fully automated assembly
process. The modules are fitted with a label designed to provide a large surface area for pick and place
operations. The label meets all the requirements for surface mount processing, as well as safety standards,
and is able to withstand reflow temperatures of up to 300
o C. The label also carries product information such
as product code, serial number and the location of manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by using open frame construction. Even so, these modules
have a relatively large mass when compared to conventional SMT components. Variables such as nozzle
size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The
minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter,
which will safely fit within the allowable component spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9
mm may also be used within the space available.
Tin Lead Soldering
The Zephyr SMT power modules are lead free modules and can be soldered either in a lead-free solder
process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data
sheets in order to customize the solder reflow profile for each application board assembly. The following
instructions must be observed when soldering these units. Failure to observe these instructions may result
in the failure of or cause damage to the modules, and can adversely affect long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak reflow temperatures are limited to less than 235
o
C.
Typically, the eutectic solder melts at 183
o
C, wets the land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There
are several types of SMT reflow technologies currently used in the industry. These surface mount power
modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of
convection/IR. For reliable soldering the solder reflow profile should be established by accurately measuring
the modules CP connector temperatures.
Lead Free Soldering
The –Z version Austin SuperLynx II SMT modules are lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause damage to the modules and can adversely affect long-
term reliability.
LINEAGE POWER 26