GE Industrial Solutions PIM400 Series - Manual (Page 14)

GE
Data Sheet
PIM400 Series; ATCA Board Power Input Modules
-36 to -75 Vdc; 400W/10A
June 20, 2013 ©2013 General Electric Company. All rights reserved. Page 14
Figure 15. PIM400 & QBVW033A0 Bus Converter Test
setup schematic
For Safety and noise considerations, copper traces must not be
routed directly under the power module (PWB top layer). C_EMI
capacitors must make direct connections (preferably without
vias) to the bus converter (DC/DC) module pins with as much
copper width as possible. In case vias are necessary, allow for
multiple connections to the inner plane with vias placed outside
the footprint of the module. For additional layout guide-lines,
refer to GE’s FLT012A0Z Input Filter Module data sheet.
Safety Considerations
For safety-agency approval of the system in which the power
module is used, the power module must be installed in
compliance with the spacing and separation requirements of
the end-use safety agency standard, i.e. UL* 60950-1, 2
nd Ed.
Recognized, CSA † C22.2 No. 60950-1-07 Certified, and VDE ‡
(EN60950-1, 2 nd Ed.) Licensed
The power input to these units is to be provided with a
maximum of fast acting 20A fuses with a voltage rating of at
least 75Vdc.
Refer to “Thermal Consideration” section for additional safety
considerations.
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be provided
to help ensure reliable operation.
Considerations include ambient temperature, airflow, module
power dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module will result
in an increase in reliability. The thermal data presented here is
based on physical measurements taken in a wind tunnel.
The thermal reference point, T
ref
, used in the specifications is
shown in Figure 16. For reliable operation this temperature
should not exceed 130
o C.
Figure 16. T
ref
Temperature Measurement Location.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating curves showing the
maximum output current that can be delivered by
each module versus local ambient temperature (T
A
)
for natural convection and up to 2 m/s (400 lfm) forced airflow
are shown in Figures 17 & 18.
Please refer to the Application Note “Thermal Characterization
Process For Open-Frame Board-Mounted Power Modules” for a
detailed discussion of thermal aspects including maximum
device temperatures.
-
48
V
O
U
TP
UT
CUR
RE
N
T
(A
)
AMBIENT TEMEPERATURE, T
A
( o C )
Figure 17. -48V Output Current Derating for the Module;
Airflow in the Transverse Direction from Pin7 to Pin1; Vin
=48V & 3.3V @ 1.5A.
3.
3V
O
UTP
UT
CUR
RE
N
T,
I O
(A
)
AMBIENT TEMEPERATURE, T
A
( o C )
Figure 18. 3.3V Output Current Derating for the Module;
Airflow in the Transverse Direction from Pin7 to Pin1; Vin
=48V & -48V Output current = 4A.
AIRFLOW