GE Industrial Solutions EBVW017A0S14R0 Series - Manual (Page 10)

Data Sheet
April 11, 2013 EBVW017A0S14R0 Series Power Modules; DC-DC Converters
36-75V
dc
Input; 14.0V
dc
Output; 17A Output Current
LINEAGE POWER 10
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant, Z version, through-hole products use
the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. The non-Z version products use lead-tin
(Pb/Sn) solder and RoHS-compliant components. Both
version modules are designed to be processed through
single or dual wave soldering machines. The pins have an
RoHS-compliant, pure tin finish that is compatible with both
Pb and Pb-free wave soldering processes. A maximum
preheat rate of 3
C/s is suggested. The wave preheat
process should be such that the temperature of the power
module board is kept below 210
C. For Pb solder, the
recommended pot temperature is 260 C, while the Pb-free
solder pot is 270 C max. Not all RoHS-compliant through-
hole products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information is
needed, please consult with your Lineage Power
representative for more details.
Reflow Lead-Free Soldering Information
The RoHS-compliant through-hole products can be
processed with the following paste-through-hole Pb or Pb-
free reflow process.
Max. sustain temperature :
245
C (J-STD-020C Table 4-2: Packaging
Thickness>=2.5 mm / Volume > 2000 mm
3 ),
Peak temperature over 245 C is not suggested due to the
potential reliability risk of components under continuous
high-temperature.
Min. sustain duration above 217
C : 90 seconds
Min. sustain duration above 180 C : 150 seconds
Max. heat up rate: 3 C/sec
Max. cool down rate: 4 C/sec
In compliance with JEDEC J-STD-020C spec for 2 times
reflow requirement.
Pb-free Reflow Profile
BMP module will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for both
Pb-free solder profiles and MSL classification
procedures. BMP will comply with JEDEC J-STD-020C
specification for 3 times reflow requirement. The suggested
Pb-free solder paste is Sn/Ag/Cu (SAC). The
recommended linear reflow profile using Sn/Ag/Cu solder is
shown in Figure 23.
Figure 23. Recommended linear reflow profile using
Sn/Ag/Cu solder.
MSL Rating
The EBVW017A0S14R0 modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages
is detailed in J-STD-033 Rev. A (Handling, Packing,
Shipping and Use of Moisture/Reflow Sensitive Surface
Mount Devices). Moisture barrier bags (MBB) with
desiccant are required for MSL ratings of 2 or greater.
These sealed packages should not be broken until time of
use. Once the original package is broken, the floor life of
the product at conditions of
30°C and 60% relative
humidity varies according to the MSL rating (see J-STD-
025A). The shelf life for dry packed SMT packages will be
a minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90% relative
humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Lineage Power Board Mounted Power Modules:
Soldering and Cleaning
Application Note (AP01-056EPS).