INFICON UHV Bakeable Sensor - Manual (Page 9)

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UHV Bakeable Sensor Operating Manual
Chapter 1
Introduction and Specifications
1.1 Introduction
The INFICON UHV Bakeable Sensor (see Figure 1-1 ) is designed to withstand
continuous bakeout temperatures up to 450°C (for bakeout only, water flow
required for actual deposition monitoring). The front load design allows for easy
insertion of the crystal holder in applications lacking sufficient room for side
insertion. All UHV Bakeable Sensors are welded to a CF40 (2-3/4 in. ConFlat®)
feedthrough. Sensor length must be specified in a sensor length specification form
provided by INFICON, which must be completed when ordering the UHV Bakeable
Sensor.
Figure 1-1 UHV Bakeable Sensor
The UHV Bakeable Sensor is available in a standard configuration where the water
tubes are parallel to the crystal face.
Optionally, sensors can be ordered with a pneumatically driven crystal shutter to
protect the crystal during source warm up, when not used during deposition of an
alternate material, or to extend crystal life when used with RateWatcher™ or rate
sampling.
NOTE: Maximum bakeout temperature for sensors with the optional crystal shutter
is reduced to 400°C.
The exposed crystal electrode is fully grounded to effectively eliminate problems
due to RF interference.