Chapter 2 operation – INFICON SQC-222 Thin Film Deposition Controller User Manual
Page 28
Chapter 2
Operation
2-9
determined by some other means, such as a stylus profilometer). Then the tooling for
this sensor would be:
(1.100 / 1.000) x 100 = 110
A simple rule to remember is: If the rate/thickness reading is low, then increase the
tooling value. If the rate/thickness reading is high, then lower the tooling value.
Xtal Tool 1 and 2 adjust the tooling for each individual sensor. It is particularly important
when using sensor averaging to balance multiple sensors so that their measurements
match. System Tooling applies to the overall Rate and Thickness measurements of all
sensors. It is sometimes used to adjust for some systematic difference in the actual vs.
measured readings. In general, Crystal Tooling (Xtal Tool 1 and 2) should be used
instead.
Multi Xtal Count sets the number of crystals in a multi-crystal sensor head. For a
standard single or dual sensor head, leave the value at 0.
Once the sensor parameters are set, test your sensor setup to assure reliable readings
at the SQC-222. Press Next Menu until the Sensor Info option is shown, then press
Sensor Info.
Any connected sensor (whether programmed On or Off) should display its frequency
and % remaining life, as defined by Min and Max Frequency setup. For a new sensor,
the value should be near 100%. If the % Life is 0.00% or jumps around, check your
cabling and the installation of the sensor in its holder.
Sigma supplies a small 5.5 MHz “test crystal adapter” with each oscillator. If the % Life
reading is not correct, remove the 6” BNC that is connected to your feedthrough at the
oscillator. Connect the test crystal and adapter to the oscillator connector labeled
Feedthrough. For a typical setup of 6 MHz Max Frequency and 5 MHz Min Frequency,
the % Life display should be near 50%.
Sensors are assigned to each Layer, as described in the Chapter 3, Layer Edit.
More information on locating system and sensor problems is described in the
Troubleshooting section, later in this chapter.