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Figure 73. time limit curve above 205oc reflow, Lead free soldering, Post solder cleaning and drying considerations – GE Industrial Solutions HW-HC004-005-006 Series User Manual

Page 26: Solder ball and cleanliness requirements, Surface mount information

Figure 73. time limit curve above 205oc reflow, Lead free soldering, Post solder cleaning and drying considerations | Solder ball and cleanliness requirements, Surface mount information | GE Industrial Solutions HW-HC004-005-006 Series User Manual | Page 26 / 28 Figure 73. time limit curve above 205oc reflow, Lead free soldering, Post solder cleaning and drying considerations | Solder ball and cleanliness requirements, Surface mount information | GE Industrial Solutions HW-HC004-005-006 Series User Manual | Page 26 / 28